Electroplated nickel gold is more normally employed on IC substrates (which include PBGA), generally for binding gold wires and copper wires; but when electroplating C substrates, more conductive wires should be manufactured with the gold finger binding place right before electroplating. The metal layers about the multilayer PCB will conduct https://8-layerthickcopperpowerpc62604.blogsvila.com/31390546/a-simple-key-for-4-layer-communication-pcb-unveiled